Robatech produces adhesive application systems for a variety of sectors, including the packaging industry. The solutions include hot melt, cold glue and PUR application systems. The company is represented in over 70 countries, and has been supplying high-quality controllers, application heads and dosing systems for over 40 years.
W. H. Leary is a leading developer of cold glue applications, as well as solutions for quality assurance and data collection in cardboard, corrugated cardboard and other paper applications. Leary's integrated glue and quality assurance solutions are based on powerful yet simple technologies that enable zero-defect production and significant productivity gains.
Robatech and W. H. Leary have been working together since 2014 and cover the entire spectrum - from cold glue solutions with QA for folding carton production, to hot melt adhesive-dispensing solutions for the final packaging.
The joint product portfolio of both companies offers the respective application technology for every gluing task. They can be combined ideally to one another and the process-specific requirements. Customers worldwide benefit from the decades of experience amassed by both companies regarding all aspects of the complete gluing process, as well as a comprehensive service and spare-parts network.
The joint companies offer leading-edge technology that is customised and environmentally friendly with its main focus being health and safety, local service, innovation, industry 4.0 and green efficiency. Customers highly appreciate the high added value and performance of the products, as well as their low energy and adhesive consumption.
With customers looking for reliability and costeffectiveness, the Robatech-Leary partnership offers a complete range of high-value solutions for the paper-converting market and packaging industry.